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Cutting-edge Technologies & Their Applications

G2-Wafer Technology

GCL Quasi-Mono wafer, with monocrystal structure, low oxygen content, low dislocation density, is produced from the ingot technology. Compared with the cells produced with traditionally casted multicrystalline wafer, the new ones have high conversion efficiency and are cost-effective.
  • Average monochromatic incident photon-to-electron conversion efficiency (IPCEC) is close to that of zochralski monocrystalline silicon
  • The effective area is 1.8% more than that of zochralski monocrystalline silicon
  • After stabilization, the modules made of G1-Wafer can generate more power with an LID 1% less than that made of the ordinary monocrystalline wafer

Silane fluidized bed new technology

GCL silane fluidized bed polysilicon manufacturing technology is the process in which trichlorosilane (SiHCl3) is disproportionation reacted into Dichlorosilane (H2SiCl2), and then disproportionation reacted into silane, from which high purity granular polysilicon is produced in the fluidized bed boiler.
  • Fully closed-loop polysilicon recycling process
  • short process with low power cost and few by-product
  • high purity (electronic grade)

Overview of the Development Route of GCL Science and Technology

  • Development of the new polysilicon technology route
  • Research & development of core equipment and processes to ensure first-class
  • Developing new crystal silicon products and further improving the conversion efficiency of PV crystalline silicon wafer
  • Gain full access to solar system integration business

Advanced ingot furnace technology

Capable of producing both polysilicon ingots and GCL Quasi-Mono ingots, GCL-ASCS-880 establishes a brand-new technology standard for the growth of PV silicon wafers and provides a high-quality and low-cost technical solution to realise grid parity for the solar industry.
  • Realise the production of polysilicon ingot and GCL Quasi-Mono ingot
  • Advanced thermal field design, precise control in ingot growth and precise ability to control the solid-liquid interface
  • High capacity, with feedstock reaching 880 Kg per furnace, 45% higher than that of Gen5
  • Low energy consumption with power consumption 20% lower than that of Gen5
  • High quality of silicon ingots

Diamond wire slicing technology

GCL has brought in diamond wire slicing technology and made remarkable progress in lowering the costs of silicon wafers. It has been proved in experiments that diamond wire slicing technology has the following advantages when compared with the traditional slicing technology:
  • Efficient slicing - slicing efficiency is improved by 150% when compared with traditional slicing technology using free abrasive materials
  • Yield rate increased - precision of silicon wafer slicing is stabilised, and metamorphic layers are reduced during the production
  • Reduction in comprehensive costs - the comprehensive costs are reduced by 25% when compared with traditional processes
  • Energy saving and environmentally-friendly-The amount of waste wire saws and mortar produced during the process has been dramatically reduced as slicing mortar can be recycled and slicing powder is convenient for recycling

Advanced solar farm system

With abundant technical research and development in the PV system, engineering design capability and extensive experiences of project construction, GCL has undertaken and implemented a number of important, large and medium-sized solar farms.
  • Solutions to the layout of PV modules on two-way downhill terrains
  • Solutions to the electrical system of the solar farms in the plateau area

GCL-Poly Energy Holdings Limited

  • Website
  • NO.88 Yangshan Road Economic Development Zone, Xuzhou, Jiangsu, China
  • 0512-6983 2615
  • +86 516 8789 1888